In January 2026 at NEPCON JAPAN in Tokyo, Fuji Corporation demonstrated the world's first automated placement of 016008 mm components — roughly half the area of the current 0201 mm (0.2x0.1 mm) minimum.
Technical Details
Fuji used its flagship NXTR placement machine with a new high-precision optical centering system and nano-nozzles for stable pickup and placement of 0.16x0.08 mm components. Key breakthrough factors:
• New optical system: Resolution enhanced to sub-micron level. Real-time "on-the-fly" centering correction for ultra-miniature components.
• Nano-coated nozzles: Special surface treatment reduces adhesion between component and nozzle, preventing displacement upon release.
• Closed-loop pressure control: Placement force precisely controlled below 0.5 N — protecting ultra-thin components from damage.
Application Scenarios
The target application for 016008 mm is next-generation edge-AI devices and wearable medical gadgets, where every square millimeter of PCB area saved carries enormous design value. Leading consumer electronics brands are expected to adopt this form factor in flagship products around 2027-2028.
Challenges for the SMT Supply Chain
Mass adoption of 016008 mm requires a systemic upgrade across the entire SMT chain: stencil aperture accuracy — from ±5 μm to ±3 μm, solder paste particle size — from Type 5 (15-25 μm) to Type 6 (5-15 μm), reflow temperature uniformity — within ±1°C.
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