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BGA Rework · Defect Localization · 8D Report

Failure Analysis & Repair

Professional failure analysis and PCBA repair: X-Ray/thermal imaging localization, precision BGA/QFN rework on repair station, 8D report documentation.

Capabilities

Defect localization: X-Ray + IR thermography + I-V curve tracing + flying probe
BGA/QFN repair: precision station, positioning accuracy ±5μm
Component-level repair: replacement of faulty ICs/resistors/capacitors/connectors
8D report: full failure analysis format
Batch repair: analysis and correction of serial defects
Root cause traceability: feedback loop with SMT and design departments

Technical Specifications

Localization methods
X-Ray + IR + I-V + flying probe
BGA repair accuracy
±5μm
Min. component
0201
Report format
8D full
Batch repair
500 pcs/day

Advantages

Precise Diagnosis

X-Ray + IR thermography + I-V — comprehensive diagnosis, not guesswork

Full 8D Report

Symptom → cause → correction → prevention — audit-ready

Closed Quality Loop

Failure analysis results fed back to SMT and design departments

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Frequently Asked Questions About Failure Analysis & Repair

What is included in qiuems's failure analysis & repair service?

Professional failure analysis and PCBA repair: X-Ray/thermal imaging localization, precision BGA/QFN rework on repair station, 8D report documentation.

How quickly can I get a quote?

We provide a detailed quotation within 24 hours for most projects. For urgent requests, we can deliver an express quote within 4 hours. Simply send your Gerber files, BOM, or project requirements through our contact form.

Do you offer free DFM (Design for Manufacturability) review?

Yes. Every project receives a free DFM analysis from our engineering team before production begins. We check trace widths, clearances, annular rings, impedance matching, material selection, and identify potential manufacturing risks. This prevents 90%+ of production issues before they occur.

What is your minimum order quantity?

We have no minimum order quantity. Whether you need 5 prototypes or 50,000 volume units, every order receives the same engineering rigor, DFM analysis, and quality inspection. We achieve competitive low-volume pricing through aggregated purchasing across our global client base.

How do you ensure quality?

Quality is verified at five inspection stages: SPI (Solder Paste Inspection) → AOI (Automated Optical Inspection) → X-Ray (for BGA/QFN joints) → ICT (In-Circuit Test) → FCT (Functional Circuit Test). All production follows IPC-A-610 Class 3 standards with 100% inspection coverage. Every batch ships with a complete quality data package.